Back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our institute which possess superior grinding performance and high cost.
Performance are among the top level worldwide. They can be used with the Japanese, German, American, Korean and Chinese grinders.
Workpiece processed: silicon wafer of discrete devices, integrated chips(IC) and virgin etc.
Material of workpiece: monocrystalline silicon and some other semiconductor materials.
Applications: back thinning, rough grinding and fine grinding.